Broadcom have produced an Application Note with recommendations for handling and soldering of their NUV-MT SiPMs.
It should be noted that the NUV-MT series SiPMs were released with a Moisture Sensitivity Level (MSL) rating of 6. Broadcom are working to upgrade this to MSL 5 but this only benefits the floor life we recommend baking for 16 hours at 125°C (+5°C/-0°C) before soldering.
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NUV-MT overmolded PCB package soldering guidelines |